Shielding cans increase Harwin’s EMC portfolio
Increased can options extend layout possibilities, reasons Harwin, as it introduces three shielding cans to assist engineers dealing with EMI/RFI issues in PCB designs.
The three new shielding cans are supplied in a tape-and-reel format. Dimensions are 10 x 10mm, 15 x 10mm and 30 x 10mm. All have a 3.0mm profile height and use a material that is 0.15mm thick.
“Tackling electromagnetic emissions is a vital aspect of modern electronic designs, particularly for those involved in wireless communication,” said Neil Moore, product manager for EMC and industrial products at Harwin.
“Now we are delivering a wider choice, aimed at helping with EMC requirements in the smallest handheld and wireless applications,” he added.
Each can is made from a single piece of un-plated nickel silver alloy using a simple five-sided shape. They fit onto a board, with the use of Harwin’s SMT shield can clips. Secondary soldering operations are eliminated, as the clips are soldered at the same time as the rest of the items populating the PCB. The risk of damaging sensitive circuitry through exposure to extreme heat during hand soldering is avoided, says Harwin.
The removable cans also provide easy access to the devices and circuitry underneath, when rework, maintenance or component replacement is necessary because the cans can be unplugged and re-inserted as required. Inconvenient de-soldering and solder clean-up is all removed from the rework process required by other EMC can styles.
With these additional cans, Harwin’s EMI/RFI shielding range covers 10mm square to 50mm x 25mm sizes, with heights from 2.5mm to 5mm and material thicknesses of 0.15mm to 0.30mm. The readymade products are all available in volume directly from stock.
Harwin produces high reliability interconnect products for the most exacting of application demands – namely the defence, aerospace, space, industrial, oil/gas and motorsport sectors.
Over the course of the last 65 years, the company says it has continued to set new benchmarks in terms of innovation, automation and service, through ongoing investment in advanced equipment and the training of its staff. Harwin’s engineers have been responsible for developing the Gecko (1.25mm pitch), Datamate (2mm pitch), Mix-Tek (combined signal, power and coax) and high temperature M300 (3mm pitch) product lines. In addition, the company offers easy-to-implement EMI/RFI shielding, a comprehensive portfolio PCB hardware (spacers, links, bridges, terminals, test points) and a broad range of industry standard connectors. All these products are available with short lead times via its sales and distribution network.
Harwin has sales offices and manufacturing facilities in the UK, the USA, Germany, France and Singapore.
