Siemens collaborates with PDF Solutions to boost IC yield and speed time to market

Siemens Digital Industries Software has struck a deal with PDF Solutions to develop a solution that transforms integrated circuit (IC) test and yield analysis data from Siemens’ Tessent software into actionable intelligence. Siemens says that this intelligence can boost manufacturing yields and accelerate time to market for new products.

Siemens’ Tessent software for IC test and diagnosis helps IC design firms enhance yield and improve quality by generating root cause defect data based on automated design analysis and end-of-line test data. However, yield challenges extend beyond IC design into manufacturing and other IC lifecycle phases, each of which produce their own categories and classes of yield data.

The new product enhancements aim to deliver a comprehensive solution that aggregates and analyses design-based, yield-relevant data from Siemens’ Tessent software, together with other yield data sources, to rapidly analyse and identify yield correlations that are otherwise undetectable quickly and, in some cases, automatically.

“Our customers face multi-dimensional yield challenges throughout all phases of the silicon lifecycle,” said Joe Sawicki, executive vice- president for the IC-EDA segment of Siemens Digital Industries Software. “Enhancing our design-based, diagnosis-driven yield analysis tools to work with PDF’s Exensio analytics platform promises exciting new opportunities for our customers to uncover yield-limiting correlations across SoC, logic and embedded memory.”

Siemens’ Tessent, YieldInsight and Tessent SiliconInsight software with PDF Solutions’ Exensio manufacturing analytics helps to break down silos and overcome barriers to cross domain yield learning. The collaboration also leverages PDF Solutions’ differentiated Fire data and layout pattern analysis with Tessent to create a closed loop environment from end-of-line test back to fab wafer processing for better monitoring of systematic yield loss, helping to improve further the NPI process.

“At PDF Solutions, we believe that collaboration with industry leaders is essential for the continued success of the semiconductor ecosystem, and the benefit of enhancing Siemens’ Tessent products to work with our Exensio analytics platform clearly supports this vision,” said John Kibarian, president, chief executive officer, and co-founder of PDF Solutions.

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