Silicon capacitors rise to power distribution network levels
Silicon process technology for mobile and high-performance computing (HPC) markets introduced by Murata support the highest performances of new power distribution networks which required low impedance over a wide frequency bandwidth.
The latest silicon process technology fabricates silicon capacitors with a density of 1.3 microF/mm². The low ESL (few pH) and low ESR of these devices support the networks’ performance levels with low impedance over a wide frequency bandwidth.
As digital ICs evolve to offer more features at lower voltages, resolving issues like noise and voltage fluctuation is critical. The resulting silicon capacitor has a profile of less than 40 micron for chip designer engineers to embed it as close to the active die in the package as possible, minimising the current’s effective path length and, thereby, minimising parasitics.
The multi-terminal devices satisfies SoC and microprocessor design requirements for multiple terminal capacitor networks, Murata confirmed. Replacing conventional monolithic ceramic capacitors with multi-terminal silicon devices reduces the total quantity of capacitors required on the board “significantly”, says the company. In addition to contributing to a compact end product, the process also results in total savings in both bill of materials and mounting costs, says Murata.
Murata manufactures electronic components, modules, and devices. The complete range includes ceramic capacitors, resistors/thermistors, inductors/chokes, timing devices, buzzers, sensors and EMI suppression filters. In addition to being a ceramic capacitor manufacturer, it also supplies Bluetooth and Wi-Fi modules, board-mount DC/DC converters as well as standard and custom AC/DC power supplies.
Established in 1944, Murata is headquartered in Japan and has European offices in Finland, France, Germany, Hungary, Italy, the Netherlands, Spain, Switzerland and the UK.
