Silicone-free thermal gap filler can be used on gaps down to 0.5mm
Silicone-free, low-viscosity and described as easy to dispense, Sarcon SPG-25B-NS exhibits a thermal conductivity of 2.5 W/m degrees K and a thermal resistance of only 2.1 degrees K•cm2/W. Fujipoly says that ehen applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills delicate gaps as small as 0.5mm. This allows for more efficient transfer and dissipation of heat from the component to enhance performance.
SPG-25B-NSA is claimed to have “excellent vibration absorption capabilities” and does not require heat curing. It will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range of -40 to +120 degrees C, adds Fujipoly. As a result, SPG-25B-NS is suitable for smaller electronic devices and higher frequencies. The gap filler is available for order in 30cc syringes or 325cc cartridges. Custom packaging is also available upon request.
Fujipoly America is a wholly owned subsidiary of Fuji Polymer Industries of Japan. An ISO9001:2015 registered company, Fujipoly America Corporation specialises in the fabrication of silicone rubber technology. It is a leader in the areas of Zebra elastomeric connectors, Sarcon thermal interface materials, fusible tapes, and custom silicone rubber extrusions. Fuji Polymer Industries has eight divisions worldwide, located in North America, Europe and Asia and an international network of distributors and representatives. The company’s North American operations are based in Carteret, New Jersey, USA.