Sinter silver formulation improves power semiconductor die attach

A screen printable sinter silver for power semiconductor die attach, released by DuPont Microcircuit Materials, is claimed to improve reliability and productivity in the power module assembly process.

The DuPont DA510 is a pressure sintering silver paste that delivers high thermal and electrical conductivity, fast takt time and superior sintered density, says the company. The associated thermal cycle reliability enables the assembly of high performance and high-density power modules for the automotive power electronics industry segment.

The new sintering silver enables the use of wide band semiconductor MOSFET chips in the rapidly increasing auto electrification market. DuPont DA510 has also shown promising results for potential use in power module heat sink attachment applications due to its ability for high quality, large area prints.

DuPont continues to invest in research, development and intellectual property involving die attach paste technology to address customer needs in this growing market segment.

DuPont Microcircuit Materials has over 50 years’ of experience in the development, manufacture, sale and support of specialised thick film compositions for a wide variety of electronic applications in the display, automotive, biomedical, industrial, military and telecommunications markets.

DuPont specialises in technology-based materials and solutions that help transform industries and everyday life. Employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety.

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