Smiths Interconnect adds DaVinci 56 test socket for graphics processing
Extending its IC testing for the semiconductor industry, Smiths Interconnect has announced an extension to its patented DaVinci test socket series for high speed test.
Designed for high speed testing of very large IC packages commonly used in gaming consoles, graphics processing and central processing units, the DaVinci series uses spring probe technology in a patented insulated material housing resulting in a coaxial structure with a reduced test height and low material deflection.
DaVinci 56 is designed for 0.8mm pitch devices, for reliable testing up to 67GHz analog RF / 56Gbits per second NRZ Digital.
“[The] IoT, autonomous vehicles, 5G wireless systems and AI are driving a need for high speed data transfer,” said vice president of sales and marketing at Smiths Interconnect, Paul Harris. “DaVinci 56. . . assures efficiency and accuracy in final testing of the most technologically advanced devices,” he added.
The DaVinci 56 has a low contact resistance of less than 80 mOhm and a current carrying capacity of 3.0A. For efficient operation, it has an entirely shielded signal path and, to enhance thermal properties, the socket frame acts as a heatsink. Smiths also offers replaceable spring probe contacts for simple in-house replacement.
Smiths Interconnect provides technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defence, space, medical, rail, semiconductor test, wireless telecommunications, and industrial market segments.
Smiths Interconnect is part of Smiths Group, a global technology group delivering products and services for the medical, security and defence, general industrial, energy and space and commercial aerospace market segments worldwide.
Smiths Group employs approximately 22,000 people in over 50 countries.
