Socionext collaborates with Arm and TSMC on 2nm multi-core CPU chiplets
A collaboration with Socionext, Arm and TSMC has been announced with the aim of developing a power optimised, 32 core CPU chiplet in TSMCʼs 2nm silicon technology. This, said Socionext will deliver scalable performance for hyperscale data centre server, 5G / 6G infrastructure, DPU and edge-of-network markets.
The advanced CPU chiplet proof-of-concept using Arm Neoverse CSS technology is designed for single or multiple instantiations within a single package, with I/O and application-specific custom chiplets to optimise performance for end applications.
Leveraging CPU chiplets, and customised application-specific chiplets, multiple target applications can be supported, added the company. When new chiplets become available, a cost-effective package level upgrade path can be supported.
Socionext provides custom SoCs for global hyperscale data centre, automotive and networking customers. “Leveraging silicon re-use to create multiple product platforms enables innovative system architectures,” said said Hisato Yoshida, corporate executive vice president and the head of global development group at Socionext.
“This chiplet complements our customersʼ current SoC designs and provides system architects new degrees of freedom to deliver many platform variants for a product family,” he added.
Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business, Arm, added: “Arm Neoverse CSS is unlocking greater accessibility to custom silicon and driving innovation across the chiplet ecosystem. The advanced chiplet proof-of-concept from Socionext is demonstrating what is possible through Arm Total Design and will accelerate the path to custom, workload-optimised solutions,” he said.
TSMC is supporting Socionext and Armʼs flexible chiplet design with its 2nm technology, offering performance, form factor and energy efficiency benefits. “We have worked with Socionext across many generations of our leading-edge technology, and look forward to extending this collaboration into the 2nm generation,” said Dr. Cliff Hou, senior vice president of corporate research / research and development at TSMC.
Socionext Europe is one of the world’s leading fabless SoC suppliers. Its headquarters is in Frankfurt, Germany and there are offices in Munich, Germany and Maidenhead, UK. The Munich Design and Support Center specialises in hardware and software product development for the automotive sector. The Maidenhead site supports Socionext’s IP Development & Engineering Center with a focus on high speed data conversion IP.
Socionext is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe.