Source-down package for Infineon’s OptiMOS reduces parasitic effects
Now available from distributor, Rutronik, Infineon Technologies’ OptiMOS power MOSFETs are in an improved package design. The 25 to 150V power MOSFETs are available in a source-down package with bottom-side cooling and centre-gate footprint. They have been optimised especially for applications where parallel connection is necessary and have the lowest possible on-resistance RDS(on) on a 5.0 x 6.0mm PCB area, claimed the company.
The OptiMOS family also features significantly reduced package parasitics and “excellent thermal performance”.
The main feature of the source-down package concept is the orientation of the active side of the silicon chip to the bottom of the component. Combined with the reinforced clip on the top of the silicon chip, package parasitics are significantly reduced while thermal performance is improved, reported Rutronik. The maximised chip / package ratio increases current capability and ensures minimised power losses. Infineon’s OptiMOS power MOSFETs enable fast switching and reduce the need for parallel switching of components, added Rutronik.
Key functions are minimised line losses, reduced voltage overshoots, increased maximum current carrying capacity and fast switching with less parallel connection of components required.
Typical applications are robotics, solar, telecommunications, low voltage drives, light electric vehicles, drones, battery management systems, Class D audio applications, USB chargers and electric tools.
The transistors are RoHS-compliant and available in reel packaging.
Rutronik Elektronische Bauelemente was founded in 1973. The independent family-owned company is based in Ispringen, Germany. It has more than 80 offices worldwide and logistics centres in Austin (Texas, USA), Shanghai, Singapore, and Hong Kong, for customer support in Europe, Asia, and North America.
The company focuses on high-growth future markets that will shape the world of electronics tomorrow. These are Advanced Materials, Advanced Measurement, Processing & Analytics, Advanced Robotics, Automation, Biotechnology, Energy & Power, Future Mobility, IIoT & Internet of everything, Industry 4.0, Medical & Healthcare, and Transportation, Logistics & Supply Chain.