Space-saving Schottky rectifier trio sets density benchmarks, says Diodes
High current Schottky rectifiers are available in compact chip scale packages (CSPs) from Diodes.
The SDM5U45EP3 (5A, 45V), the SDM4A40EP3 (4A, 40V) and SDT4U40EP3 (4A, 40V) rectifiers are claimed to achieve the industry’s highest current densities in their class and are designed for smaller and more powerful electronic systems.
Each rectifier can be used for a variety of purposes, for example, serving as blocking or reverse-polarity protection diodes, electrical over-stress protection diodes and free-wheeling diodes. They are supplied in CPs for use in space-constrained applications, such as portable, mobile, and wearable devices, as well as IoT hardware.
The SDT4U40EP3 is claimed to be the industry’s smallest 4A trench Schottky rectifier and also believed to be the first in a 1608 package. It takes 90 per cent less PCB area than competing devices, said Diodes. Its 800A/cm2 current density. According to Diode, its cathode design and manufacturing process make it the highest density trench Schottky in the industry. The low forward voltage performance (0.47V typical) minimises power losses while its avalanche capability makes it robust enough to deal with extreme operating conditions, including transient voltages, said Diodes.
The SDM5U45EP3 is in a X3-TSN1616-2 packaged with a 2mm2 footprint. The SDM4A40EP3 and SDT4U40EP3 are packaged in a X3-TSN1608-2 with a footprint of 1.28mm2. These rectifiers enable system designers to maximise board real estate in highly integrated consumer products, advised Diodes. The thin CSPs have a typical profile of just 0.25mm and have shortened thermal paths to reduce power dissipation and thermal bill of materials (BoM) costs and to increase reliability.
Advance samples of all three Schottky rectifiers are available on request.
Diodes delivers semiconductor products to companies in the consumer electronics, computing, communications, industrial, and automotive markets. It has an expanded product portfolio of discrete, analogue and mixed-signal products and packaging technology. It has a broad range of application-specific products and operations at 31 sites, including engineering, testing, manufacturing, and customer service.