StratEdge offers thermally enhanced packages for compound semiconductors
Outline glass sidewall, thermally enhanced packages from StratEdge can be used for silicon, silicon carbide (SiC), gallium nitride (GaN) and other compound semiconductors in power IC applications. Specific devices include amplifiers, discrete transistors, and diodes where greater than 0.5W is consumed.
The thermally enhanced packages are designed for reliability and to mitigate the inherent stresses of brazing dissimilar materials together. Materials used in the packages have matched co-efficients of expansion and the packages are assembled using a glass-to-metal seal process combined with gold germanium brazing. This, says StratEdge results in a rugged and reliable package. They can operate in temperatures up to 360 degrees C. A hermetic seal provides enhanced reliability for the device and offers protection from harsh environmental conditions, meeting military standard requirements. Packages are sealed with metal or ceramic lids that have gold-tin solder preforms.
“These packages incorporate copper composite bases or copper inserts for enhanced thermal dissipation,” said Casey Krawiec, vice president of global sales for StratEdge. “Devices are mounted directly to the metal bases thus providing excellent electric ground to the backside of the chip. They provide superior electrical performance for frequencies up to at least 6GHz. For controlled impedance devices, transition designs with higher frequency performance can be utilised,” he added.
Packages are available in various shapes, sizes, and lead counts. All can be provided with gull wing-shaped leads for surface mounting. The two-lead GW1010CT-1 package, for example, has a thermally enhanced copper tungsten base, supplied with copper insert. It has a 0.100 inch square (2.5mm square) outline with a die attach area of 0.030 inch (0.76mm) by 0.055 inch (1.40mm) die attach area.
StratEdge was founded in 1992. The company designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz.
StratEdge offers post-fired ceramic, low-cost moluded ceramic, and ceramic QFN packages, and specialises in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecomms for 5G, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole.
All packages are lead-free and most meet RoHS and WEEE standards. StratEdge is ITAR registered and an ISO 9001:2015 certified facility located in Santee, California, USA.
