Stray-field robust 3D HAL position sensors have integrated decoupling capacitors

3D sensors based on Hall-effect technology allow active stray-field compensation of homogenous and gradient fields. The HAC 39xy sensors have been added to the Micronas 3D HAL sensor portfolio by TDK.

They are supplied in a single-mould three-pin TO92UF leaded package with integrated capacitors for stray-field robust position detection in automotive and industrial applications. The TO92UF package was designed explicitly for PCB-less applications, combining both a chip from the HAL 39xy family with stray-field compensation capability, and up to two capacitors with up to 330nF. The sensors suit a wide range of applications, including valves and actuators, gear shifters, transmission systems, or brake stroke position detection. The PSI5 interface supports the latest requirements of chassis-position detection sensors, adds TDK.

HAC 39xy sensors enable angular measurements up to 360 degrees with ferrite two-pole magnets and linear measurements up to 35mm by using two-pole bar magnets. The stray-field robust position detection can take both measurement types, with additional 3D measurements resulting in two independent angles. The ‘sent’ interface transmits data from both angles while the sensors achieve a high ESD immunity and meet all stringent EMC requirements, TDK assures customers.

The patented 3D HAL pixel-cell technology accurately measures magnetic fields while being insensitive to stray fields. It enables the direct measurement of magnetic fields in three directions X, Y, Z. The flexible sensor array helps design engineers select the best operation mode for any given measurement task.

Modern Hall-effect sensors need to be insensitive against disturbing fields generated by e-motors or power lines in hybrid or electrical vehicles (xHEV), notes TDK. With its flexible architecture, HAC 39xy offers a range of configuration possibilities. It features a powerful DSP, which is responsible for fast signal processing, and an embedded microcontroller that performs the interface configuration and supervision of the functional safety related tasks. The architecture of the HAC 39xy sensors makes it easy for customers to develop new solutions using fast prototyping techniques. It also enables quick and easy adaptation to changes in interface standards such as ‘sent’ and PSI5.

The pins of the TO92UF package can be welded or soldered directly to a lead frame, eliminating the need for a PCB, thus reducing the total system size and cost. This also “significantly” improves the overall system long-term reliability, adds TDK.

Samples are available now and mass production will start by the end of 2021.

https://www.micronas.tdk.com

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