System in package complies with SGET’s Open Standard Module

A system in package (SiP) by Aries Embedded, the MSMP1, is compatible with SGET’s Open Standard Module and integrates ST Microelectronics’ STM32MP1 microprocessor with single or dual Arm Cortex-A7 cores (up to 800MHz), combined with a Cortex-M4 core (up to 209MHz). 

“Almost all functions of the CPU are available on the small board measuring only 30 by 45mm,” explained Andreas Widder, managing director of Aries Embedded. The 476 contacts of the SiP module allow the CPU to be used transparently in demanding industrial, medical or IoT applications, he added. The SiP features low power consumption and is a small form factor and competitively priced, said Aries Embedded.

The MSMP1 modules are scalable in terms of performance and memory expansion and can be individually adapted to meet project requirements. The SiP supports 512Mbyte to 4Gbyte DDR3L RAM and four to 64Gbyte eMMC NAND flash memory capacities. Interfaces available include 10/100/1000Mbit Ethernet, USB2.0 host / OTG (on the go), two CAN, UART, I2C, SPI, ADC/DAC, as well as a parallel display interface and camera input. 

The modules are available in the commercial temperature range, i.e. 0 to +70 degrees C, as well as in the industrial temperature range (-40 to +85 degrees C).

Samples of the MSMP1 SiP will be available from the third quarter of 2022. Aries Embedded confirmed it will start series production in the fourth quarter of 2022.

Latest News from Softei

This news story is brought to you by, the specialist site dedicated to delivering information about what’s new in the electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Softei Registration