Texas Instruments produces power module in QFN
Believed to be the industry’s smallest 36V, 4.0A power module, the TPSM53604 DC/DC buck module cuts the size of power supplies by 30 per cent, says Texas Instruments (TI).
The TPSM53604 is offered in a quad flat no-lead (QFN) package and measures 5.0 x 5.5mm to reduce the size of the power supply and reduce power loss by 50 per cent, compared to similar competing modules, says TI. The power module comes with a single thermal pad to optimise heat transfer, enabling engineers to simplify board mounting and layout.
The TPSM53604 can operate in ambient temperatures up to +105 degrees C to support rugged applications in factory automation and control, grid infrastructure, test and measurement, industrial transport and aerospace and defence.
TI advises that the TPSM53604 can be paired with a compact step-down module such as the TPSM82813 and TPSM82810, to create a power solution from a 24V input down to the point of load, while minimising design time and effort.
The total area is 85mm2 for a single-sided layout and suitable for common 24V, 4.0A industrial applications. The standard QFN footprint helps simplify design to reduce time to market.
The package efficiently dissipates heat at high ambient temperatures, says TI. 42 per cent of the QFN package footprint touches the board, enabling more efficient heat transfer compared to ball grid-array (BGA) packages. The module’s buck converter integrates MOSFETs with low drain-source on resistance (RDS(on)) to enable conversion efficiency of 90 per cent at 24V to 5.0V.
To ensure it meets the EMI standard defined by CISPR 11 Class B limits, the module has integrated high-frequency bypass capacitors and no bond wires.
In addition to the module, which is available now, there is also the TPSM53604 evaluation module.
Texas Instruments produces products for use in connected cars and intelligent homes to self-monitoring health devices and automated factories. Its products are at work in virtually every type of electronic system, says the company, which has operations in more than 30 countries, where it engineers, manufactures, tests and sells analogue and embedded semiconductor chips.
