TVS diode arrays by Littelfuse are AEC-Q101-qualified

Claimed to outperform polymer-based technologies, bidirectional TVS diode arrays (SPA diodes) from Littelfuse protect high speed consumer electronics interfaces from damaging electrostatic discharge (ESD) in applications where PCB layout is especially challenging.

The SP3208-01UTG, the first TVS diode array in the SP3208 series, is mechanically optimised to deliver consistently low capacitance (nominally 0.08pF).

A second series, the SP3213-01UTG, is the first SP3213 series device. It offers an option for highly cost-conscious ESD protection solutions.

Both low capacitance ESD protection devices are AEC-Q101-qualified. They employ the same base die and can safely absorb repetitive ESD strikes at ±12 kV without performance degradation and dissipate 2.0A of 8/20 micro second surge current.

Typical applications for SP3208 and SP3213 series TVS diode arrays include high speed data lines and interfaces, such as USB 3.2, 3.1, 3.0, 2.0, HDMI 2.1. 2.0, 1.4a, 1.3, DisplayPort, Thunderbolt and V-by-One. They can also be specified for use in low power antenna ports, consumer, mobile and portable electronics and tablet PCs and external storage with high speed interfaces.

“Rising data rate speeds present significant challenges to design engineers who need to maintain high signal integrity,” said Tim Micun, business development manager, TVS Diode Arrays (SPA Diodes) at Littelfuse. “Compared to other ESD protection solutions on the market, the SP3208 and SP3213 Series provide 50 per cent lower nominal capacitance, which helps preserve signal integrity and minimise data loss. Providing a passband in excess of 30GHz allows signal integrity engineers to create a high speed, data capable environment.”

The SP3208 and SP3213 series TVS diode arrays’ benefits include sub-0.1 pF silicon-based ESD protection which allows for passbands as high as 30GHz. This, claims Littelfuse, enables high signal integrity for the world’s fastest data interfaces.

The industry-standard 0201DFN packaging with internal construction enhancements reduces parasitic capacitance, inductance, and resistance. According to the company, this makes the diode arrays easier to model into a protection scheme.

Lower parasitic capacitance and inductance permit better dynamic resistance performance, protecting the circuit faster and better.

Both TVS diode array series are available now in surface-mount uDFN-2 (0201) packages in tape and reel format.

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