Ultra ECP 3d has pre-wet process and pulse partial plating
For conformally filled 3D TSV copper plating, the Ultra ECP 3d employs a pre-wet process and pulse partial plating to achieve conformally filled, void-free, high aspect ratio through-silicon vias (TSVs), says ACM Research.
The wafer processing supplier for semiconductor and advanced wafer-level packaging (WLP) applications announced the Ultra ECP 3d platform which leverages its Ultra ECP ap and map platforms. It is claimed to deliver high-performance copper (Cu) electroplating for high aspect ratio (HAR) Cu applications, with no voids or seams. Key markets for devices using TSVs include imaging, memory, MEMS and optoelectronics.
According to industry research firm Mordor Intelligence, “The 3D TSV devices market was valued at USD $2.8billion in 2019 and is expected to reach USD $4.0billion by 2025, at a CAGR of 6.2 per cent over the forecast period of 2020 – 2025.”
“Many factors are driving the growth of the 3D TSV market, from device miniaturisation to artificial intelligence (AI) and edge computing,” said David Wang, CEO of ACM. “These applications demand more processing power in ever higher density packages and are leading to rapid industry adoption of TSV technologies,” he explained.
The company has worked with customers to demonstrate its ability to fill HAR vias using the Ultra ECP 3d platform. “In addition to delivering higher throughput with a stacked chamber design, the platform is designed to use fewer consumables, have a lower total cost of ownership, and save valuable fab floor space,” Wang added.
During bottom-up filling for HAR TSVs, the Cu electrolyte must be able to completely fill the vias without any trapped air bubbles when immersed in the plating solution. To accelerate this process, an integrated pre-wet step is used.
According to ACM Research, the Ultra ECP 3d technology can deliver better yields, greater plating efficiency and higher throughput during the fabrication process. The Ultra ECP 3d platform for 3D TSV is a 10-chamber, 300mm tool with integrated pre-wet, Cu plating and post-clean modules in a footprint of only 2.20 x 3.60 x 2.90m.