Ultrasonic sensor module stands firm to avoid collisions

Designed with a sensor element which is mechanically decoupled from the sensor module housing, the USSM1.0 PLUS-FS is immune to external mechanical vibrations, said TDK. They are suitable for obstacle detection and collision avoidance in mobile systems, such as autonomous robots and autonomous guided vehicles.

Decoupling the sensor element from the housing makes the IP65 / 67 protected sensor (order number B59110W2111W032) immune to external mechanical vibrations that can falsify the measurement result, said TDK. The module is supplied with a nominal voltage of 12V and can be mounted in a front chassis via a M19 thread with a locking nut or via snap hooks.

Actuated via a driver and an integrated piezoelectric disk, the integrated signal processor ASIC can calculate the signal propagation time with a repetition rate of up to 50 samples per seconds. This allows measuring distances from 18 to 200cm. In pitch-and-catch mode with several modules, even measuring distances of 4.0cm are feasible, advised TDK. 

The field-of-view (FoV) of the USSM1.0 PLUS-FS can be optimised to ±35 degrees. Individual measurement scenarios can also be programmed. 

The sensor module is suitable for a range of brightness conditions, including full sunlight, and measures accurately regardless of the colour and translucence of the target object, claimed the company.

The ultrasonic modules are particularly well suited for distance measurement and obstacle detection under difficult environmental conditions in autonomous mobile robots (AMR) or autonomous guided vehicles (AGVs).

They can measure distance in stationary systems for level measurement.


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