VadaTech introduces AMC card with Xilinx UltraScale+ FPGA

The AMC584 is the latest module from VadaTech. It is a double-module in an advanced mezzanine card (AMC) form factor card with Xilinx Virtex UltraScale+ XCVU13P FPGA and two banks of 64-bit wide DDR4. The XCVU13P FPGA provides over 12,000 DSP slices and 3,780 thousand logic cells, adds VadaTech.

The XCVU13P FPGA is routed to base and extended option regions (all the tongue one SerDes are routed). The module routes up to 20 lanes to Tongue 2 for PinoutPlus connection to neighbouring AMCs (in chassis supporting this option) such as the AMC750, supporting high-speed data throughput within the MicroTCA standard. The front panel QSFP28 ports support data output of up to five times 100Gbit Ethernet over standard connectors for ease of connection to external equipment.

The AMC584 also contains a high-speed Zone 3 connector that provides the primary digital I/O routing. Multiple high-speed data acquisition modules (e.g. VadaTech AMC594) can be connected to the AMC584 (e.g. for generating I/Q or multi-polarisations). Alternatively, this I/O can be routed to further FPGA AMCs for additional processing.  

The combination of AMC584 and AMC594 allows system integrators to construct signal acquisition systems with sample rates up to 56Gsample per second, supported by extensive DSP processing and with up to 500Gbit per second output.  

VadaTech provides embedded computing solutions from board-level products, chassis-level platforms, to configurable application-ready systems. Its focus is on AdvancedTCA, MicroTCA, VPX and PCIe as it combines electrical, mechanical, software, and system-level expertise which enables VadaTech to provide customised commercial or rugged computing solutions to meet customers’ complex requirements. VadaTech also offers specialised products for VME, CompactPCI, and other architectures. The company is a member of PICMG and VITA. It has headquarters, design and manufacturing facilities in Henderson, Nevada, USA, with design, support and sales offices in Europe and Asia Pacific.

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