Ventilated panels meet needs of instrumentation cases

Embedded computing and enclosure company, Pixus Technologies, now offers several sizes for its ventilated panels for electronics enclosures.  The panels fit the company’s modular Rittal Vario and RiCase aluminum cases. The ventilation panels allow airflow in Pixus’ instrumentation cases. Customers can mix and match ventilated and non-ventilated panels on the front or rear of the enclosure.  The panels are available in 84 and 42HP size for 19 and 9.5-inch enclosures respectively. Hinged panels are also available. Panel customisation is optional, including custom cut-outs, painting/powder coating, and silk screening.

Pixus provides instrumentation cases in one to 12U heights and various widths, depths. The company also offers open standard backplane and chassis platforms as well as related embedded computing components.

Pixus Technologies was founded in 2009 and comprises industry experts in electronics packaging. It was created by senior management from Kaparel Corporation, a Rittal company. Pixus Technologies’ embedded backplanes and systems are focused primarily on OpenVPX, MicroTCA, ATCA, cPCI Serial, and custom designs. Pixus has a portfolio of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the sole authorised North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.

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