Vicor’s latest ChiP-set addresses AI accelerator cards

Designed for high performance graphics processing units (GPUs), central processing units (CPUs) and application specific integrated circuit (ASIC) or XPU processors powered directly from 48V, the 4609 ChiP-set has been added to Vicor’s Power-on-Package portfolio.

A driver, MCD4609, and a pair of MCM4609 current multiplier modules supply up to 650A continuous and 1,200A peak. Vicor reports that the small footprint and low profile (45.7 x 8.6 x 3.2mm) enable the current multipliers to be placed close to the processor, enabling reduced power distribution network (PDN) losses and higher power system efficiency.

Powering GPU and Open Compute Project (OCP) accelerator module (OAM) artificial intelligent (AI) cards, the 4609 ChiP-set is in mass production and available on Vicor’s Hydra II evaluation board.    

The 4609 ChiP-set is part of Vicor’s Power-on-Package portfolio of Lateral Power Delivery (LPD) solutions.

Vicor has also revealed that its Vertical Power Delivery (VPD) will soon enable much higher current density. The VPD system delivers current from power converters vertically stacked under a processor through a capacitor network geared to a processor-specific pin-map. A Geared Current Multiplier (GCM) is a specialised VPD device, incorporating a gearbox capacitor network as a layer in the vertical stack. By supplying current directly under the processor and eliminating PDN losses, GCMs will soon facilitate current densities reaching up to 2A/mm2, says Vicor.

Vicor IP on the critical path to Power-on-Package LPD and VPD is claimed to enable unparalleled current density and efficient current delivery for advanced processors in applications including AI accelerator cards, AI high density clusters and high-speed networking.

Vicor designs, develops, manufactures and markets modular power components and complete power systems based on a portfolio of patented technologies.

The company is headquartered in Andover, Massachusetts, USA and sells its products to the power systems market, including enterprise and high-performance computing, industrial equipment and automation, telecommunications and network infrastructure, vehicles and transportation, aerospace and defence.

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