VITA connectors comply to revised standard

Connector manufacturer, Samtec, has introduced VITA 42 XMC 12mm mated connector sets. The 12mm stack heights comply with the recent ANSI/VITA 42.0 XMC Standard

Samtec is an ANSI/VITA member and has released the connectors that are compliant for the revised ANSI/VITA 42.0-2016 XMC Standard, which defines an open standard for supporting high-speed, switched interconnect protocols on an existing, widely deployed form factor.

This revision further defines solder ball attachment which replaced paste-on-pad (POP) for improved solder joints and low insertion force (LIF) sockets to ease mating and un-mating. It also defined tin-lead alloy as a solder option and the 12mm stack height. The standard also revised ASP catalogue numbers.

Based on these guidelines, Samtec adds the 12mm stack height options to its family of ANSI/VITA 42 XMC Standard connectors. On account of its high reliability, stemming from the multipoint-of-contact SamArray sockets, and robust solder ball design, the updated connector set has been specified for current XMC systems, confirms Samtec.

The company’s XMC connectors enable switched communication between a mezzanine card and its carrier. In addition to transmitting sensitive high-speed data, they provide power, ground, and auxiliary signals to the mezzanine. The 12mm mated connector optimises XMC cards for use in wider modules, designed for 1.00-inch (2.54mm) pitch cage systems.

Samtec’s support for the updated VITA 42.0 provides an alternative to PPP attachments while providing low insertion force contacts.

Founded in 1976, Samtec is a privately held, global manufacturer of a broad line of electronic interconnect solutions, including IC-to-Board and IC packaging, high-speed board-to-board, high-speed cables, mid-board and panel optics, flexible stacking, and micro/rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimise both the performance and cost of a system from the bare die to an interface 100m away, and all interconnect points in between. The company has 33 locations in 24 different countries.