Winbond’s BGA package achieves JEDEC standard for carbon reduction
Winbond Electronics has announced that its latest package for its memories, the 100BGA LPDDR4/4X has achieved the JEDEC JED209-4 standard for energy conservation and carbon reduction.
The LPDDR4/4X is now available in a space-saving 100BGA package which measures 7.5 x 10mm2. The memory is suitable for IoT applications which require higher throughput in a small package. Winbond explained that it allows designers to reduce the PCB size for more compact IoT designs.
Winbond’s LPDDR4/4X memory is available in density of 1Gbit and 2Gbit, supporting speeds of up to 4267Mbits per second. It is available in both single die package (SDP) with a 2Gbit density and dual die package (DDP) with a 4Gbit density. The higher speed of LPDDR4 1CH x16 4267Mbits per second offers improved performance over previous DDR4 x16 3200Mbps devices. Winbond said this is especially useful for consumer applications.
Winbond guarantees the LPDDR4/4X product line will be manufactured for at least the next 10 years. This is particularly relevant to developers in the automotive and industrial applications where long design cycles are common practice.
Winbond Electronics is a memory provider. The company provides customer-driven memory backed by the capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio consists of specialty DRAM, mobile DRAM, code storage flash, and TrustME secure flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. It has 12-inch fabs in Taichung and Kaohsiung, Taiwan.