Dispensable thermal gel can be use in very thin bond lines
Dispensable gel that “excels in thin bond line applications” has been released by Parker Chomerics. The Therm-A-Gap Gel 50TBL is a new thermal interface material for use in very thin bond. It offers 5W/m-K bulk thermal conductivity. At a minimum bond line thickness of 0.05 mm, the apparent thermal conductivity exceeds 10 W/m-K.
The Therm-A-Gap Gel 50TBL (thin bond line) offers low thermal impedance and avoids any pump-out effect with temperature changes. It needs no mixing or secondary curing, and is therefore simple to apply and there is the potential for it to be used in reworking too. The gel’s flow rate is 25g per minute using a 30cc syringe with 2.5m orifice (at 621 kPa).
Another attribute of the gel is that it requires very low compressive force to conform under assembly pressure, ensuring components, solder joints and leads encounter minimal stresses.
As is the case with all thermal gels from Parker Chomerics, the Therm-A-Gap Gel 50TBL is suitable for both automated dispensing machines and field repair situations.
Typical applications for this advanced thermal gel, include automotive electronic control units (ECUs), telecommunications base stations, consumer electronics, power supplies, semiconductors, LEDs, microprocessors and graphics processors. The gel is primarily for thin bond lines and is not typically intended for use as a filler in gaps larger than 0.50mm.
Electrical properties of Therm-A-Gap Gel 50TBL include a 200V AC per mm dielectric strength (Chomerics test method), a volume resistivity of 1014 Ohm cm (ASTM D257), a dielectric constant at 1000kHz of 7.0 (ASTM D150) and a 0.002 dissipation factor at 1000 kHz (Chomerics). It is also RoHS-compliant and operates in temperatures ranging from -55 to +200 degrees C.
Therm-A-Gap Gel 50TBL is available in syringe, cartridge and pail containers, offering standard fill volumes from 10 to 2500cc.
Chomerics is a division of Parker Hannifin, developing electrically and thermally conductive materials in electronics, transportation and alternative energy systems.
