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Press-fit terminal power modules for a solder-free solution in high-volume manufacturing

Thu, 07 December
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Infineon introduces new CoolMOS™ S7T with integrated temperature sensor

Thu, 07 December
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Motor driver ICs are first to enable full torque at zero speed for sensorless brushless DC motors

Thu, 07 December
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ST extends MasterGaN performance and value with new 200W and 500W devices

Wed, 06 December
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ST introduces AI-enabled automotive inertial measurement unit for always-aware applications up to 125°C

Tue, 05 December
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Toshiba launches photovoltaic output photocoupler for automotive

Tue, 05 December
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TI expands low-power GaN portfolio, enabling AC/DC power adapters to shrink 50%

Mon, 04 December
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Rohm’s new high power 120w laser diode for LiDAR

Fri, 01 December
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Renesas unveils the first generation of 32-bit RISC-V CPU core

Fri, 01 December
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Nexperia’s first SiC MOSFETs raise the bar for safe, robust and reliable power switching

Fri, 01 December
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PowiGaN enables efficient, low-profile, & stackable PFC circuits

Fri, 01 December
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ST collaborates with indie Semiconductor to enhance in-car wireless charging privacy and security

Fri, 01 December
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Infineon introduces the industry’s first USB 10 Gbps peripheral controller

Thu, 30 November
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NXP introduces battery cell controller IC designed for lifetime performance and battery pack safety

Wed, 29 November
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Infineon introduces the first 15 V trench power MOSFETs with OptiMOS™ 7 technology in PQFN packages

Wed, 29 November
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Market leaders collaborate with Synopsys to realize gains of Generative AI

Wed, 29 November
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Digiseq and Infineon launch world-first pre-certified ring inlay

Tue, 28 November
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Microchip unveils new standard of enhanced code security with the PIC18-Q24 family of MCUs

Tue, 28 November
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High performance PCIe SSD engineered for reliability and endurance

Tue, 28 November
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Snapdragon 7-Series mobile platform provides performance and power efficiency with First-in-Tier features

Mon, 27 November
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