Fischer extends contact materials with pasty thermal conductive material
Fischer Elektronik extends its portfolio of contact materials especially designed for the application of the thermal contacting by a fluid gel thermal conductive material with its GEL S 18.
The thermal conductive material GEL S 18 is a pasty, gel-like and fully hardening thermal conductive material in a two-component system. GEL S 18 is suited for a filling small or large empty spaces in electronic devices such as the mounting of PCBs on heatsinks. The viscoelastic paste has a very good construction flexibility, reports Fischer Elektronik, with sound adhesive properties. This allows an easy handling as well as a secure mounting of the components to be contacted.
Furthermore the material characterises itself by a very good thermal conductivity with a low thermal impedance as well as a range of operating temperatures. GEL S 18 is easy to use, continues Fischer Elektronik, can be dispensed automatically. It can be formed with low compressive force, whereby the load on the electronic components is reduced significantly which otherwise would lead to early functional failures of the device or to damages of the PCB.
The material is rated with UL 94 V-0 and durable for six months when stored at temperatures of 25 degrees C. The pot life at room temperature is 60 minutes with the associated hardening time of 300 minutes at room temperature and 10 minutes at 100 degrees C.
GEL S 18 is supplied in a 50cc double chamber cartridge with three additional static mixing tube as a standard. Optionally an applicator gun for this kind of cartridge is available.
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