LPKF says AMP saves time and space in antenna integration

For RF applications ranging from consumer electronics and the automotive industry to the aerospace sector, LPKF has developed Active Mold Packaging (AMP) interconnect technology for IC packaging. The AMP process is a progressive alternative to current mmWave antenna design and manufacturing approaches inside IC and system in package (SiP) packages. It provides a space-saving, simple, and reliable method of integrating planar antennae directly into or onto packages, confirms the company.

Converting the previously unused areas of the epoxy mould compound (EMC) of an IC package into an active carrier of electrical functionality offers additional metallisation layers on the surface and in the volume of the EMC. As a result, AMP enables a new approach towards mmWave applications, says LPKF.

The simple, time-saving, and reliable technology is based on three proven and standardised electronic production technologies: EMC encapsulation, laser processing using laser direct structuring (LDS), and selective metallisation of the laser-processed areas with copper. AMP is a mid-range packaging technology offering a resolution of 25 micron line width and space.

One advantage offered by AMP is the direct connection to the underlying encapsulated circuit. The signal’s path length, inductance, capacity, and impedance can be configured and fine-tuned with reduced complexity, confirms LPKF. The yield and service life issues arising in other processes due to complex connections between the antenna and feed line are largely minimised, adds the company.

AMP covers a wide range of RF applications. It covers 5G and beyond 5G technology or RF technologies classified as 6G including waveguides and striplines and mmWave antennae as antenna in package (AiP), antenna on package (AoP) modules operating in the sub-6GHz, 24GHz, 61GHz and 121GHz ISM bands.

AMP allows 76 to 81GHz automotive radar modules to be realised, as well as 5G amplifiers and EMI shielding. Other applications of this process include package on package (PoP), 2L interposers, multi-chip modules (MCM), thermal management, and SiP connections.


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