MesoSphere plasma system accelerates 3D and wafer level package assembly
Nordson March has introduced the MesoSphere plasma systems, claiming they enable very high throughput processing for 3D and wafer-level package assembly. They are designed for substrates up to 480mm during semiconductor packaging.
The MesoSphere plasma system can be used for high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.
For wafer cleaning, the MesoSphere plasma system removes contamination prior to wafer bumping, organic contamination, fluorine and other halogen contamination, and metal and metal oxides. Plasma improves spun-on film adhesion and cleans metallic bond pads.
For wafer etching, the MesoSphere plasma system descums wafers of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhances adhesion of wafer applied materials, removes excess wafer applied mould /epoxy, enhances adhesion of gold solder bumps, destresses wafer to reduce breakage, improves spun-on film adhesion, and cleans aluminium bond pads.
The MesoSphere’s chamber design and control architecture enable short plasma cycle times with very low overhead, maximising throughput and minimising the cost of ownership, says Nordson March. Plasma confinement technology uses a ring to isolate and focus plasma so it’s distributed directly above the wafer, minimising undesired secondary reactions. Process temperatures can be kept low because the ring increases etch rate capability without increasing the electrode temperature or adding bias to the chuck.
An innovative handling system transfers round or square substrates and frame or bonded carriers. The modular design allows capacity increase on a per plasma chamber basis. Equipment front end module (EFEM) integration supports from one to four plasma chambers. A pocket chuck design provides accurate substrate placement and centring, for additional process repeatability.
The isolation allows customers to perform advanced packaging without having to use an expensive carrier, explains Nordson March, with the additional benefit that it can be used with 300mm wafers on frames.
