Multi-layer chip NTC thermistors use conduction adhesion
Able to be mounted using conductive adhesion, multi-layer temperature sensors from TDK are capable of operating in temperatures up to 150 degrees C.
The chip NTC thermistors have been added to TDK’s NTCSP family and have AgPd (silver palladium alloy) terminations, which enable conductive adhesion mounting. This is particularly beneficial for applications where soldering is difficult.
They are designed for temperature sensing and compensation, and measure without direct contact in automotive applications including anti-locking brake systems (ABS), inside the transmission system or engine, for example. The NTCSP thermistors are available in 10, 47 and 100 kOhm version. The NTCSP103JF103FT1S, the NTCSP104BF473FT1SX and the NTCSP104KF104FT1S have dimensions of 1.0 x 0.5mm while the NTCSP163JF103FT1S, the NTCSP164BF473FT1SX and NTCSP164KF104FT1S have dimensions of 1.6 x 0.8mm.
The operating temperature range is from -55 to +150 degrees C. The NTCSP series is certified by AEC-Q200 for passive components standardised by the Automotive Electronics Council (AEC).
TDK Corporation was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. TDK’s comprehensive portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices and magnetic heads. Its products are marketed under the product brands TDK, Epcos, InvenSense, Micronas, Tronics and TDK-Lambda.
TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.
