Nexperia and Semikron Danfoss explore strategic collaboration on SiC power modules
Nexperia and Semikron Danfoss have signed a Memorandum of Understanding (MoU) to explore a strategic collaboration on silicon carbide (SiC)-based power modules for automotive traction inverter applications. The collaboration aims to combine Nexperia’s expertise in SiC semiconductor technology with Semikron Danfoss’ leading capabilities in power module packaging and integration. Together, the companies intend to evaluate how a joint approach can enable high-performance, scalable solutions for next-generation electric vehicles.
SiC technology plays a critical role in improving the efficiency, power density, and performance of electric drivetrains. By bringing together complementary competencies across the value chain – from chip to module – the companies aim to advance optimised solutions tailored to the demanding requirements of automotive applications. As part of the collaboration, both companies will explore joint engineering approaches, including early integration and co-design, to unlock the full performance potential of SiC-based systems.
Carsten Götte, SVP Semikron Danfoss Automotive Power Modules Division, said: “By combining advanced semiconductor technology from Nexperia with our module expertise, we see strong potential to achieve more together than either could alone. We look forward to exploring how this collaboration can create additional value for our customers in the rapidly evolving electric vehicle market.”
Edoardo Merli, SVP and Head of Business Group Wide Bandgap, IGBT & Modules (WIM), Nexperia, said: “Strong partnerships are essential to unlocking the full potential of wide bandgap technologies, including SiC and GaN. With our continued R&D investments and strong focus on early-stage collaboration, we actively drive the alignment of semiconductor and system requirements from the outset. We are excited to explore how this partnership with Semikron Danfoss, a global leader in power electronics, can advance our module offering.”
