Package redesign reduces SoC development time, reports Sondrel

Turnkey ASIC service provider, Sondrel says it has noticed increased lead times for SoC package design and manufacturing, particularly for flip chip BGAs. These extended lead times could impact the overall project timelines for product development.

“People think that they have to do things in a set sequence and hence don’t sort out the bump and ball co-ordinates until the design is finalised and ready to tape out to the fab,” explained Ed Loverseed, Sondrel’s head of engineering. “Unfortunately, the increased lead times for packaging can now mean that the silicon will be produced before the packaging is ready,” he added.

Sondrel has devised an SoC packaging solution. By assigning die bumps and determining the x/y coordinates relative to the die corner, the package planning and design can be started earlier by generating the bump coordinates before top level physical design and final RDL routing are completed.

The bump locations for each macro and PHYs, as specified by the IP vendors can be determined using the floor plan and the SoC partitions. For hard macros, such as PCIe or HDMI, the bumps’ locations are specified by the relative offset from the macro corner; in soft macros, for example, DDR, location is based on a pattern and a minimum pitch in the bump assignment.

The final bump assignment still has to be checked against the final chip layout, but Sondrel says it has found that this method gives “an excellent first approximation” to start the SoC package planning and design.

Founded in 2002, Sondrel is a partner of choice for handling every stage of an IC’s creation. Its define and design ASIC consulting is complemented by its turnkey services to transform designs into tested, volume-packaged silicon chips. Having a single point of contact for the entire supply chain process ensures low risk and faster times to market, says the company.

Headquartered in the UK, Sondrel supports customers around the world via offices in China, India, France, Morocco and North America. 

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