Packaging improves mechanical strength in battery management
RigidCSP technology for battery management allows a decrease in on-resistance and an increase in mechanical strength, says Alpha and Omega Semiconductor (AOS).
As a result, there is less breakage during assembly and stress during the lifetime of the battery MOSFET. The package technology is designed for applications such as smartphones, tablets, and thin notebooks.
Prevalence of higher charging current means that low electrical resistance is needed for improved performance. In standard wafer level chip scale packaging (WL- CSP), the substrate can be a significant portion of the total resistance on the back-to-back MOSFETs. A thinner substrate will reduce the overall resistance but also will drastically reduce the mechanical strength, explains AOS, which can produce more stress during the PCB assembly reflow process, which can lead to die warpage or die crack, jepoardising the performance.
“RigidCSP can be used for high aspect ratio CSP die size, and RigidCSP can enable an overall reduction in warpage/breakage from assembly board manufacturing,” said Peter H. Wilson, marketing director of MOSFET product line at AOS.
The company offers the AOCR32326 and AOCR36330 30V Common drain dual N-channel MOSFETs. Maximum resistance for the AOCR32326 is 2.6mOhms at 10V, 2.9mOhms at 8.0V and 4.2mOhms at 4.2V. It is supplied in a 6.0 x 2.5mm package. For the AOCR36330, RSS (on) is 1.4mOhm at 10V, 1.6mOhm at 8.0V and 2.9mOhm at 4.5V. This version is supplied in a package which measures 6.22 x 2.5mm.
The AOCR32326 and AOCR36330 are immediately available in production quantities with a lead-time of 14 to16 weeks.
Alpha and Omega Semiconductor (AOS) is a designer, developer and global supplier of a broad range of power semiconductors, including a wide portfolio of power MOSFET, IGBT, IPM, TVS, HVIC, SiC/GaN, Power IC and digital power products.
AOS has developed extensive intellectual property (IP) and technical knowledge to introduce innovative products for the increasingly complex power requirements of advanced electronics. AOS differentiates itself by integrating its discrete and IC semiconductor process technology, product design, and advanced packaging expertise to develop high-performance power management solutions.
The company’s products target high volume applications, including portable computers, flat panel TVs, LED lighting, smartphones, battery packs, consumer and industrial motor controls, and power supplies for TVs, computers, servers, and telecommunications equipment.
