Recom introduces low profile QFN-package with flip-chip technology

The latest addition to Recom’s DC/DC converter portfolio is claimed to be one of the smallest in its class of low profile QFN-packaged buck regulator power modules. The RPX-2.5 module uses flip-chip technology which increases power density and improves thermal management, says the company.

The power module offers a high power density footprint on a 4.5 x 4.0 x 2.0mm thermally-enhanced QFN package. The RPX-2.5 provides an input range from 4.5 to 28V DC, allowing 5.0, 12 or 24V supply voltages to be used.

The output voltage can be set with two resistors in the range from 1.2 up to 6.0V. The maximum output current is 2.5A and the output is protected against continuous short-circuits, output over-current, or over-temperature faults. The RPX-2.5 has an efficiency of up to 92 per cent. In addition to optimised thermal performance, due to flip-chip technology, the module has an integrated shielded inductor making the miniature package suitable for space-constrained applications.

There is an evaluation board, available for customers to quickly and easily test the product.

Converter samples and evaluation boards are available from all authorised distributors or directly from Recom.

RECOM Power supplies a range of DC/DC and AC/DC converters in every power class up to 960W, switching regulators and LED drivers in a selection of designs. The company introduced the R-78 switching regulators which have now become industry standard.

The company is headquartered in Gmunden, Austria and has a worldwide distribution network.

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