SiC Schottky barrier diode from Microchip is AEC-Q101-qualified

Electric vehicle (EV) system designers can meet stringent automotive quality standards across a wide range of voltage, current and package options, assures Microchip.

The 700 and 1200V SiC Schottky Barrier Diodes (SBD) are AEC-Q101-qualified to maximise system reliability and ruggedness and enable stable and lasting application life, says Microchip. The devices’ superior avalanche performance allows designers to reduce the need for external protection circuits, reducing system cost and complexity.

Microchip’s SiC technology and multiple IATF 16949:2016-certified fabrication facilities provide flexible manufacturing alternatives, helping minimise risk in the supply chain.

Unlike other SiC devices that degrade under extreme conditions, Microchip devices have demonstrated no degradation in performance, increasing the application life.   

The company’s SiC SBD ruggedness testing demonstrates 20 per cent higher energy withstand in unclamped inductive switching (UIS), and among the lowest leakage currents at elevated temperatures, increasing system life and enabling a more reliable operation.

Microchip also provides a broad portfolio of 700, 1200 and 1700V SiC SBD and MOSFET power modules using its latest generation of SiC die.

Microchip’s AEC-Q101-qualified SiC SBD devices are supported with SPICE and PLECS simulation models and MPLAB Mindi Analog Simulator. Also available is a PLECS reference design model that uses Microchip’s SBDs (1200V, 50A) as part of the power stage — the Vienna 3-Phase Power Factor Correction (PFC) reference design.

Microchip’s AEC-Q101 qualified 700 and 1200V SiC SBD devices (also available as die for power modules) for automotive applications are available now for volume production orders.

Microchip Technology provides smart, connected and secure embedded control solutions. Its development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defence, communications and computing markets.

The company is headquartered in Chandler, Arizona, USA.

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