Six temperature monitoring ICs extend Thermoflagger range

Toshiba Electronic Europe has added six temperature monitoring ICs bringing the total number of Thermoflagger over-temperature detection ICs to eight. 

The ICs detect temperature increases in electronic devices to ensure safety in mobile devices, home appliances and industrial equipment.

The TCTH011AE, TCTH012AE, TCTH021AE, TCTH022AE, TCTH011BE and TCTH012BE complement the existing TCTH021BE and TCTH022BE Thermoflagger ICs. They add another positive temperature current out (PTCO) of 1.0 microA. A flag signal (PTC good) is available as either push-pull or open-drain along with the option to have the flag signal latching or not. 

The devices can identify temperature rises by detecting a change in resistance value due to temperature within a PTC. By connecting PTC thermistors in series, temperature can be monitored at several points. 

The ICs are capable of operating in an ambient temperature between -40 and +125 degrees C. They operate from a supply voltage (VDD) in the range of 1.7 to 5.5V and feature current consumption as low as 1.8 microA (typical). 

The ICs are housed in a small, industry-standard SOT-553 (ESV) package measuring just 1.6 x 1.6 x 0.55mm. 

Toshiba has also released a reference design featuring the Thermoflagger devices. 

Toshiba has collaborated with Murata Manufacturing which recommends the Thermoflagger ICs as suitable for use with its PTC thermistors. 

Shipments of the six new Thermoflagger devices start today.

Toshiba Electronics Europe offers a variety of hard disk drive (HDD) products and semiconductor solutions for automotive, industrial, IoT, motion control, telecomms, networking, consumer and white goods applications. The company’s portfolio encompasses power semiconductors and other discrete devices ranging from diodes to logic ICs, optical semiconductors as well as microcontrollers and application specific standard products (ASSPs).

The company also offers SCiB battery cells and modules with lithium titanium oxide (LTO) for heavy-duty applications and silicon nitride (SiN) ceramic substrates with heat dissipation and strength characteristics, designed for use in power semiconductor modules, inverters and converters.

TEE has its headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom providing marketing, sales and logistics services. 

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