XSPairFET has higher power density for computing

Alpha and Omega Semiconductor has released a new generation of its XSPairFET in a DFN 3.3 x 3.3 package.

The company claims that the AONE36132 sets a new industry standard for high power density applications. The 25V n-channel MOSFET is supplied in a dual DFN 3.3 x 3.3mm package which is particularly suitable for synchronous buck converters.

The AONE36132 extends Alpha and Omega Semiconductor’s XSPairFET lineup.  It is designed with the latest bottom source packaging technology and has lower switch node ringing due to lower parasitic inductance. The AONE36132 XSPairFET can be used for computing, server and telecommunications markets.

AONE36132 has an integrated high-side and low-side MOSFETs (seven and two mOhms maximum on-resistance, respectively) within a DFN XSPairFET package. The low-side MOSFET source is connected directly to the exposed pad on a PCB to enhance thermal dissipation, adds the company. Using an existing notebook design under typical conditions, 19V input, with 1.05V output, and a 21A output load condition, the AONE36132 had more than a two per cent efficiency improvement when compared to a single DFN 5.0 x 6.0mm high side and single DFN 5.0 x 6.0mm low side configuration.

The AONE36132 is immediately available in production quantities with a lead-time of 12 to 14 weeks.

Alpha and Omega Semiconductor, or AOS, is a designer, developer and global supplier of a range of power semiconductors, including a portfolio of power MOSFET, IGBT, IPM and power IC products. AOS has developed extensive intellectual property and technical knowledge which has enabled it to introduce products to address the increasingly complex power requirements of advanced electronics. AOS differentiates itself by integrating its discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high performance power management solutions. AOS products are used in portable computers, flat panel TVs, LED lighting, smart phones, battery packs, consumer and industrial motor controls and power supplies for TVs, computers, servers and telecommunications equipment.


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