Fischer Elektronik has new angle on heatsinks
As more power semiconductors are being used on the functional PCB, rather than handled separately from control and signal processing, designers are finding that heat loss can be significant. Heatsinks can cool the devices and mounting next to the device to be cooled is a common practice for efficient heat dissipation. Now, Fischer Elektronik has added 72 versions of finger shaped heatsinks to its product range.
The series FK 259 up to FK 282 finger shaped or board level heatsink are made of heat conducting copper with a fundamental structure of a base plate which simultaneously presents the contact area of the device and is connected to the device to be cooled. Straight or angled cooling tabs provide a thermotechnical optimal connection and retaining clips integrated in the production process are claimed to ensure optimal heat transfer between the electrical device and the finger shaped heatsink by using a high contact pressure.
For solder mounting the board level heatsink to the PCB, integrated solder pins are available for the horizontal or vertical mounting whereby the total package heatsink / device is mounted to the PCB and additionally mechanically stabilised. The solderable surface coating of the heatsinks’ designs is done according to the EC directive RoHS and Fischer Elektronik guarantees solderability for wave and reflow soldering.
The series FK 259 up to FK 282 board level heatsinks are, depending on the performance class, thermally matched to the most popular transistor designs, such as TO 220 up to TO 247 as well as SIP Multiwatt to allow heat dissipation on smallest mounting space.
Further modifications and special designs can be realised according to customer specifications, advises Fischer Elektronik.
