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Mouser shares design solutions for advanced robotics development

Wed, 13 August
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Arrow unveils world’s first dev kit featuring production silicon Altera Agilex 5 FPGA

Tue, 12 August
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AKM’s premium DAC delivers sound quality for high-end audio applications

Fri, 08 August
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The new Schurter UST 1206 chip fuses now available from Rutronik

Thu, 07 August
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Tria enhances SMARC portfolio with new module based on Renesas RZ/G3E processor

Wed, 30 July
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Mouser now stocking new TDK converters for AI, IoT, 5G, and big data

Mon, 21 July
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Harting Han-Modular Domino connectors available from Powell

Wed, 16 July
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Quectel Wi-Fi 6/Bluetooth 5.3 modules for smart and industrial IoT applications

Tue, 08 July
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New 1-stage filter for 3-phase systems from Schurter now at Rutronik

Fri, 04 July
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High-Performance cooling fans for electronic systems from EBM-Papst

Mon, 30 June
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New TE connectors for data centre and networking applications available from Mouser

Mon, 23 June
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Infineon PSOC Control C3 MCUs for Next-Generation Motor Control now at mouser

Thu, 19 June
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High-speed photo relays from Toshiba now at Rutronik

Mon, 16 June
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Tria’s new family of compute modules powered by Qualcomm processors

Thu, 12 June
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TDK InvenSense’s ultrasonic ToF range sensor for ultra-long-range applications

Fri, 06 June
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BeagleBoard Wi-Fi 6 Bluetooth LE wireless modules now at Mouser

Fri, 30 May
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Rutronik offers USB Type-C connectors from Molex for industrial and consumer applications

Wed, 28 May
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Cissoid’s modular SIC inverter platform available from Rhopoint

Wed, 28 May
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Raspberry Pi RP2350 MCU for embedded and industrial IoT applications

Wed, 21 May
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Rutronik introduces the next-gen adapter board RAB7 for Sensorfusion

Tue, 13 May
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7 days ago

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Moxa acquires cybersecurity certificates for wireless product portfolio Moxa Europe has announced that the company has become one of the first companies to achieve the EU type-examination certification under Radio Equipment Directive Delegated Act (RED-DA) for industrial networking devices, including Moxa OnCell G4300-LTE4 Series cellular routers, AIG-302 Series advanced IIoT gateways, and AWK Wi-Fi 6 Series APs/bridge/clients.The EN 18031 series (RED-DA), #electronicsnews #softei #technews ... See MoreSee Less

Moxa acquires cybersecurity certificates for wireless product portfolio - Softei.com - Global Electronics Industry News

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Moxa acquires cybersecurity certificates for wireless product portfolio - Industry News
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1 week ago

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Kioxia announces NVMe SSD built for the demands of generative AI environments Kioxia has announced that it has expanded its high-capacity Kioxia LC9 Series enterprise SSD line-up by introducing the industry’s first 245.76 terabyte (TB) NVMe SSD in 2.5-inch and Enterprise and Datacenter Standard Form Factor (EDSFF) E3.L form factor. This new capacity and form factor option complements the previously announced 122.88 TB (2.5-inch) model and is purpose-built for #electronicsnews #softei #technews ... See MoreSee Less

Kioxia announces NVMe SSD built for the demands of generative AI environments - Softei.com - Global Electronics Industry News

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Kioxia announces NVMe SSD built for the demands of generative AI environments - Latest News
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1 week ago

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Next-generation package for power MOSFETs from Toshiba Toshiba has announced the launch of two new N-channel power MOSFETs, the 80V TPM1R908QM and the 150V TPM7R10CQ5. These latest offerings adopt Toshiba’s SOP Advance(E) package, designed to enhance performance in switched-mode power supplies for demanding industrial equipment, including data centres and communication base stations.The new SOP Advance(E) package marks an improvement over Toshiba’s #technews #electronicsnews #softei ... See MoreSee Less

Next-generation package for power MOSFETs from Toshiba - Softei.com - Global Electronics Industry News

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Next-generation package for power MOSFETs from Toshiba - Latest News
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2 weeks ago

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Adlink launches cExpress-R8 a compact solution to Demanding Industrial Workloads Adlink has introduced the cExpress-R8, a COM Express COM.0 R3.1 Type 6 Compact module powered by AMD Ryzen Embedded 8000 Series processors (8845HS, 8840U, 8645HS, 8640U). Engineered for the demands of modern smart industrial applications, it delivers an advanced integration of high-performance and energy-efficient design. This module ignites mission-critical AI capabilities, #electronicsnews #softei #technews ... See MoreSee Less

Adlink launches cExpress-R8 a compact solution to Demanding Industrial Workloads - Softei.com - Global Electronics Industry News

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Adlink launches cExpress-R8 a compact solution to Demanding Industrial Workloads - Latest News
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2 weeks ago

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Ibase announces new outdoor computer for extreme environments Ibase has launched the ARS200, a rugged, waterproof all-in-one outdoor computer engineered for high-reliability performance in extreme conditions. Purpose-built for mission-critical applications, the ARS200 combines durable industrial-grade hardware with environmental resilience, making it ideal for smart transportation, traffic monitoring, industrial automation, outdoor digital signage, and energy #electronicsnews #softei #technews ... See MoreSee Less

Ibase announces new outdoor computer for extreme environments - Softei.com - Global Electronics Industry News

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Ibase announces new outdoor computer for extreme environments - Latest News
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2 weeks ago

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Rohde & Schwarz verifies Next Generation eCall for EN 17240:2024 Standard Rohde & Schwarz has announced its work with Qualcomm Technologies to verify the implementation of Next Generation eCall (NG eCall) on Qualcomm Technologies’ Snapdragon® Auto 5G Modem-RF, in line with the most recent specification EN 17240:2024.Introduced in 2015, eCall, an automated vehicle emergency call system, has been a mandatory requirement for all new cars sold within the #softei #technews #electronicsnews ... See MoreSee Less

Rohde & Schwarz verifies Next Generation eCall for EN 17240:2024 Standard - Softei.com - Global Electronics Industry News

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Rohde & Schwarz verifies Next Generation eCall for EN 17240:2024 Standard - Industry News Highlights
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2 weeks ago

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NeoCortec to show NeoMesh on LoRa modulation at The Things Conference 2025 At The Things Conference 2025 in Amsterdam, The Netherlands from 23rd to 24th September 2025, NeoCortec, manufacturer of ultra-low-power bi-directional wireless mesh networking protocol stack, and its Italian partner Embit, manufacturer of wireless modules, will be showing their latest EMB-LR1121-e/mesh module - a dual band (subGHz/2.4GHz), embedded LoRa-enabled NeoMesh wireless network #softei #electronicsnews #technews ... See MoreSee Less

NeoCortec to show NeoMesh on LoRa modulation at The Things Conference 2025 - Softei.com - Global Electronics Industry News

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NeoCortec to show NeoMesh on LoRa modulation at The Things Conference 2025 - Industry News
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2 weeks ago

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Latest Mouser series navigates the balance of AI and human expertise in engineering Mouser has released its latest instalment of the Empowering Innovation Together (EIT) technology series, AI-powered engineering. This instalment explores the balancing act of utilising the capabilities of Artificial Intelligence (AI) with human expertise. AI-powered tools are now enabling engineers to streamline complex design processes with unprecedented precision.By #softei #technews #electronicsnews ... See MoreSee Less

Latest Mouser series navigates the balance of AI and human expertise in engineering - Softei.com - Global Electronics Industry News

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Latest Mouser series navigates the balance of AI and human expertise in engineering - Industry News
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2 weeks ago

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Nexperia brings the benefits of clip-bonded FlatPower packaging to bipolar junction transistors Nexperia has announced the expansion of its bipolar junction transistor (BJTs) portfolio by introducing 12 new MJD-style BJTs in clip-bonded FlatPower (CFP15B) packaging. This new offering released as MJPE-series addresses the ongoing industry demand for more power-efficient and cost-effective designs in both industrial and automotive applications. Compared to #technews #softei #electronicsnews ... See MoreSee Less

Nexperia brings the benefits of clip-bonded FlatPower packaging to bipolar junction transistors - Softei.com - Global Electronics Industry News

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Nexperia brings the benefits of clip-bonded FlatPower packaging to bipolar junction transistors - Latest News
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3 weeks ago

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Bourns announces its smallest package automotive grade thick film resistors Bourns has announced its AEC-Q200 compliant, automotive grade CR01005A-AS Series Thick Film Resistors. An extension to the company’s CR-A-AS Series, these new resistors feature an extremely small package size (0.4 mm x 0.2 mm x 0.13 mm) and have a sulfur-resistant design (ASTM B-809). The series’ enhanced resistance to corrosion-related failures helps to improve system stability, #electronicsnews #technews #softei ... See MoreSee Less

Bourns announces its smallest package automotive grade thick film resistors - Softei.com - Global Electronics Industry News

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Bourns announces its smallest package automotive grade thick film resistors - Latest News
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Renesas introduces 64-bit RZ/G3E MPU for high-performance HMI systems #softei #technews #electronicsnews

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binder addresses miniaturization in power supply systems #technews #softei #electronicsnews

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USB Type-C and USB PD controllers complete Nexperia’s turnkey offering #electronicsnews #technews #softei

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New Click board from Mikroe provides ethernet connectivity for embedded systems #technews #softei #electronicsnews

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